Formulation and characterization of high thermal conductivity copper nanofluids for a single step industrial heat transfer application system for microelectronics and automobiles

Dr M.Subas Chandra Bose, G. Visalakshi, S. Saranya


This research article investigate a novel method for the formulation of stable, non–agglomerated copper nanofluids by reducing copper sulphate pentahydrate with sodium hypophosphite chemical as a reducing agent in ethylene glycol as base power fluid by means of conventional heat transfer process in electronics, electrical and automobiles. This is an insitu, single step method, which gives very high yield of product with less time duration. The characterization of the nanofluid was done by particle size analyzer, x-ray diffraction (XRD), uv-visible (UV-VIS) analysis and Fourier transform infrared spectroscopy (FTIR) followed by thermal conductivity studies of nanofluid by the well known transient hot wire anemometer method.

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